Intel DB75EN, Specification

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1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor
Micro-ATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
Processor
•
3
rd
generation Intel
®
Core processor family and 2
nd
generation Intel
®
Core
processor family processors with up to 95 W TDP in an LGA1155 socket
― One PCI Express* 3.0 x16 graphics interface
― Integrated memory controller with dual channel DDR3 memory support
― Integrated graphics processing (processors with Intel ® HD Graphics)
― External graphics interface controller
Memory
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMs
•
Support for 1 Gb, 2 Gb, and 4 Gb memory technology
•
Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory
• Support for XMP memory
Note: DDR3 1600 MHz DIMMs are only supported by 3
rd
generation Intel Core
processor family processors
Chipset
Intel
®
B75 Express Chipset consisting of the Intel
®
B75 Express Platform
Controller Hub (PCH)
Graphics
•
Integrated graphics support for processors with Intel ® Graphics Technology:
― VGA
― DVI-D
• Support for a PCI Express 3.0 x16 add-in graphics card
Note: PCI Express 3.0 is only supported by 3
rd
generation Intel Core
processor family processors
Audio 8-channel (6+2) Intel High Definition Audio via the Realtek* ALC662 audio codec
continued