Intel 82G35 Design Manuallines Download Page 1

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Document Number:

317609-001

Intel

G35 Express Chipset

Thermal and Mechanical Design Guidelines

— For the Intel

82G35 Graphics and Memory Controller Hub

(GMCH)

August 2007

Summary of Contents for 82G35

Page 1: ...Document Number 317609 001 Intel G35 Express Chipset Thermal and Mechanical Design Guidelines For the Intel 82G35 Graphics and Memory Controller Hub GMCH August 2007...

Page 2: ...product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future...

Page 3: ...14 2 4 4 TCONTROL Limit 14 2 5 Non Critical to Function Solder Balls 15 3 Thermal Metrology 17 3 1 Case Temperature Measurements 17 3 1 1 Thermocouple Attach Methodology 17 3 2 Airflow Characterizatio...

Page 4: ...Figure 14 GMCH Reference Heatsink for ATX Platforms Sheet 1 33 Figure 15 GMCH Reference Heatsink for ATX Platforms Sheet 2 34 Figure 16 GMCH Heatsink for ATX Platforms Anchor 35 Figure 17 GMCH Refere...

Page 5: ...Thermal and Mechanical Design Guidelines 5 Revision History Revision Number Description Date 001 Initial release August 2007...

Page 6: ...6 Thermal and Mechanical Design Guidelines...

Page 7: ...design a cooling solution for systems that implement the GMCH Properly designed solutions provide adequate cooling to maintain the GMCH case temperature at or below thermal specifications This is acco...

Page 8: ...temperature at the component of interest The ambient temperature should be measured just upstream of airflow for a passive heatsink or at the fan inlet for an active heatsink TC The case temperature o...

Page 9: ...d Intel Pentium Dual Core Processor Thermal and Mechanical Design Guidelines http www intel com design processor spe cupdt 313279 htm Intel Core 2 Extreme Quad Core Processor and Intel Core 2 Quad Pro...

Page 10: ...Introduction 10 Thermal and Mechanical Design Guidelines...

Page 11: ...6in x 10 52 mm 0 414in and is subject to change A mechanical drawing of the package is shown in Figure 11 2 1 1 Non Grid Array Package Ball Placement The GMCH package uses a balls anywhere concept Min...

Page 12: ...W20 AV20 BA19 BB19 BC18 BA18 BB18 BB20 BC20 AR24 AN24 AM24 AT24 AL24 AK24 AJ24 AP24 AL23 AM23 AK23 AJ23 AL21 AK21 AJ21 AM21 AT23 AN23 AP23 AR23 AN21 AT21 AP21 AR21 AM26 AL26 AK26 AJ26 AL27 AM27 AK27 A...

Page 13: ...n normal operating conditions including VCC and TC MAX while executing real worst case power intensive applications This value is based on expected worst case data traffic patterns and usage of the ch...

Page 14: ...is two 2 DIMMs per channel DDR2 FSB operating at the top speed allowed by the chipset with a processor operating at that system bus speed FC BGA packages have poor heat transfer capability into the bo...

Page 15: ...3 BB3 BB4 AR9 AM7 AM5 AM6 AM8 AJ6 AJ5 AL6 AL5 AJ8 AJ7 AL8 AL7 AR6 AR5 AN6 AN5 AN8 AR7 AN7 AM9 AM10 AM11 AJ10 AJ9 AL10 AL9 AJ11 AL11 AN11 AR11 AT11 AN9 AP12 AR12 AN12 AT12 BB9 AY9 BA9 AU9 AW9 AV9 AY6 A...

Page 16: ...Product Specifications 16 Thermal and Mechanical Design Guidelines...

Page 17: ...d the heatsink base if a heatsink is used To minimize these measurement errors a thermocouple attach with a zero degree methodology is recommended 3 1 1 Thermocouple Attach Methodology 1 Mill a 3 3 mm...

Page 18: ...ology 18 Thermal and Mechanical Design Guidelines Figure 4 0 Angle Attach Methodology top view not to scale Figure 5 0 Angle Attach Heatsink Modifications generic heatsink side and bottom view shown n...

Page 19: ...ors that combine air velocity and temperature measurements Typical airflow sensor technology may include hot wire anemometers Figure 6 provides guidance for airflow velocity measurement locations whic...

Page 20: ...Thermal Metrology 20 Thermal and Mechanical Design Guidelines...

Page 21: ...election 4 1 1 ATX Form Factor Operating Environment In ATX platforms an airflow speed of 0 76 m s 150 lfm is assumed be present 25 mm 1 in in front of the heatsink air inlet side of the attached refe...

Page 22: ...tains in line airflow directly from the processor thermal module Since the processor thermal module provides lower inlet temperature airflow to the processor reduced inlet ambient temperatures are als...

Page 23: ...the corners and securing the plastic ramp retainers through the anchor loops before snapping each retainer into the fin gap The wire preload clip should be left loose in the extrusion during the wave...

Page 24: ...ia the heatsink A thermal interface material Honeywell PCM45F is pre applied to the heatsink bottom over an area in contact with the package die Note To minimize solder ball joint reliability risk the...

Page 25: ...a mass of 550g The test profiles are unpackaged board level limits Table 3 ATX Reference Thermal Solution Environmental Reliability Requirements Board Level Test1 Requirement Pass Fail Criteria2 Mecha...

Page 26: ...ycles on off of minimum temperature 27 C maximum temperature 96 C 1400 cycles on off of minimum temperature 35 C maximum temperature 96 C A 15 second dwell at high low temperature for both test cycles...

Page 27: ...ist and or these devices may be subject to change without notice Table 5 ATX Intel Reference Heatsink Enabled Suppliers for Intel G35 Express Chipset ATX Items Intel PN AVC CCI Foxconn Wieson Heatsink...

Page 28: ...nts Raichel Hsu 886 2 2299 6930 ext 7630 raichel_hsi avc com tw Monica Chih 886 2 2995 2666 monica_chih ccic com tw CCI Chaun Choung Technology Harry Lin 714 739 5797 hlinack aol com Jack Chen 408 919...

Page 29: ...heet 1 33 GMCH Reference Heatsink for ATX Platforms Sheet 2 34 GMCH Heatsink for ATX Platforms Anchor 35 GMCH Reference Heatsink for ATX Platforms Ramp Retainer Sheet 1 36 GMCH Reference Heatsink for...

Page 30: ...Mechanical Drawings 30 Thermal and Mechanical Design Guidelines Figure 11 GMCH Package Drawing...

Page 31: ...R TMD DEPARTMENT NA FINISH NA MATERIAL 5 27 04 C KOEPSELL DATE APPROVED BY DATE CHECKED BY DATE CHECKED BY 4 30 04 C BERMENSOLO DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TO...

Page 32: ...ATERIAL mm dd yy DANA GRINDLE DATE APPROVED BY mm dd yy X DATE CHECKED BY 06 01 05 KG TAN DATE DRAWN BY mm dd yy KG TAN DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES...

Page 33: ...994 DIMENSIONS ARE IN MILLIMETERS ALL UNTOLERANCED LINEAR DIMENSIONS 0 1 ANGLES 0 5 THIRD ANGLE PROJECTION PARTS LIST DESCRIPTION PART NUMBER ITEM NO QTY HSNK EXTD FBGA 16 AL D31682 001 TOP NOTES 1 TH...

Page 34: ...20 787 20 787 THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED REPRODUCED DISPLAYED OR MODIFIED WITHOUT THE PRIOR W...

Page 35: ...050u M I N N I C K E L U N D E R P LA T I N G S O LD E R T A I LS 0 000100 M I N T I N O N LY S O LD E R LE A D F R E E 5 M A R K W I T H I N T E L P N A N D R E V I S I O N P E R I N T E L M A R K I...

Page 36: ...A K A S T M D 638 46 F LE X U R A L M O D U LU S A S T M D 638 3116 M P a 10 S O F T E N I N G T E M P V I C A T R A T E B 154 C C C O LO R A P P R O X I M A T I N G B LA C K R E F G E 739 D R E G R I...

Page 37: ...CH Reference Heatsink for ATX Platforms Ramp Retainer Sheet 2 B B 6 1 75 069 2 75 108 6 0 5 020 4 157 6 5 56 219 2X 6 2 9 114 6 4 252 6 3 15 124 6 4 7 5 187 3 118 5 2 205 1 19 047 6 55 258 2X 6 5 76 2...

Page 38: ...D BY 09 06 05 DANA GRINDLE 09 06 05 C BERMENSOLO DATE CHECKED BY 08 08 05 KGTAN DATE DRAWN BY 07 10 05 KGTAN DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDAN...

Page 39: ...WRITTEN CONSENT OF INTEL CORPORATION REVISION HISTORY ZONE REV DESCRIPTION DATE APPROVED D29080 1 A DWG NO SHT REV DEPARTMENT R CORP 2200 MISSION COLLEGE BLVD P O BOX 58119 SANTA CLARA CA 95052 8119 T...

Page 40: ...09 06 05 DANA GRINDLE DATE APPROVED BY 09 06 05 DANA GRINDLE O9 06 05 C BERMENSOLO DATE CHECKED BY 08 12 05 KGTAN DATE DRAWN BY 08 08 05 KGTAN DATE DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DI...

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