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5
1.3
Pin Arrangement and Functions
1.3.1
Pin Arrangement
Figure 1.2 shows the standard COT (chip on tape) pattern of the H8/3150 series. Figure 1.3 shows
the bonding pad arrangement of the wafer product. The COT is mounted on a tape.
V
CC
RES
CLK
NC
V
SS
NC
I/O-1/
IRQ
NC
Figure 1.2 Standard COT Pattern (Electrode Surface)