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If the CPU upgrade or replacement kit contains a new heat sink, a thin
layer of thermal compound has already been pre-applied to its lower
surface. In this case, it isn’t necessary to apply thermal paste to the heat
sink lower surface.
Figure 110: Thermal paste syringe
One thermal compound syringe (FSP:P304000004) contains thermal paste for
three CPUs.
In order to determine the correct amount of thermal paste (equal to 1.0 gram),
divide the grey area of the syringe up into three equal segments.
Add graduation marks to the syringe using a permanent marker to help
you apply the thermal paste.
Processor (CPU)
GX2570 M6
Upgrade and Maintenance Manual
171
Summary of Contents for PRIMERGY GX2570 M6
Page 66: ...Basic hardware procedures 66 Upgrade and Maintenance Manual GX2570 M6 ...
Page 78: ...Basic software procedures 78 Upgrade and Maintenance Manual GX2570 M6 ...
Page 154: ...Expansion cards and riser modules 154 Upgrade and Maintenance Manual GX2570 M6 ...
Page 188: ...Graphic processor GPU 188 Upgrade and Maintenance Manual GX2570 M6 ...
Page 234: ... Switching on the server on page 49 Midplane kit 234 Upgrade and Maintenance Manual GX2570 M6 ...
Page 242: ...Front panel 242 Upgrade and Maintenance Manual GX2570 M6 ...
Page 252: ...System board and components 252 Upgrade and Maintenance Manual GX2570 M6 ...
Page 274: ...Appendix A 274 Upgrade and Maintenance Manual GX2570 M6 ...
Page 281: ...AIOM adapter Card AIOM adapter Card AOM 438G AIOM P VGA Port C11 JVGA1 ...