APPENDIX D PRECAUTIONS ON MOUNTING
S1C17704 TECHNICAL MANUAL
EPSON
AP-37
Precautions for Visible Radiation (when bare chip is mounted)
Visible radiation causes semiconductor devices to change electrical characteristics. It may cause the IC to
malfunction or the nonvolatile memory data to be erased.
When developing products, consider the following precautions to prevent malfunctions caused by visible
radiation.
(1) Design the product and bond the IC on the board so that it is shielded from visible radiation in actual use.
(2) The inspection process of the product needs an environment that shields the IC from visible radiation.
(3) Shield not only the face of the IC but the back and side as well.
(4) After the shielded package has been opened, the IC chip should be bonded on the board within one week.
If the IC chip must be stored after the package has been opened, be sure to shield the IC from visible
radiation.
(5) If there is a possibility that heat stress exceeding the reflow soldering condition is applied to the IC in the
bonding process, perform enough evaluation of data stored in the nonvolatile memory before the product is
shipped.
Other
The 0.25 µm fine-pattern process is employed to manufacture this series of products.
Although the product is designed to meet EIAJ and MIL standards regarding basic IC reliability, please pay
careful attention to the following points when actually mounting the chip on a board.
Since all the oscillator input/output pins are constructed to use the internal 0.25 µm transistors directly, the
pins are susceptible to mechanical damage during the board-mounting process. Moreover, the pins may also be
susceptible to electrical damage caused by such disturbances (listed below) whose electrical strength, varying
gradually with time, could exceed the absolute maximum rated voltage (2.5 V) of the IC:
(1) Electromagnetic induction noise from the utility power supply in the reflow process during board-mounting,
rework process after board-mounting, or individual characteristic evaluation (experimental confirmation),
and
(2) Electromagnetic induction noise from the tip of a soldering iron
Especially when using a soldering iron, make sure that the IC GND and soldering iron GND are at the same
potential before soldering.
Summary of Contents for S1C17704
Page 1: ...TECHNICAL MANUAL S1C17704 CMOS 16 BIT SINGLE CHIP MICROCOMPUTER ...
Page 22: ...1 OVERVIEW 1 10 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...
Page 42: ...3 MEMORY MAP BUS CONTROL 3 12 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...
Page 82: ...6 INTERRUPT CONTROLLER ITC 6 26 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...
Page 108: ...8 CLOCK GENERATOR CLG 8 8 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...
Page 112: ...9 PRESCALER PSC 9 4 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...
Page 138: ...10 I O PORTS P 10 26 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...
Page 156: ...11 16 BIT TIMERS T16 11 18 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...
Page 208: ...14 8 BIT OSC1 TIMER T8OSC1 14 16 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...
Page 234: ...16 STOPWATCH TIMER SWT 16 14 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...
Page 242: ...17 WATCHDOG TIMER WDT 17 8 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...
Page 264: ...18 UART 18 22 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...
Page 300: ...20 I2C 20 20 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...
Page 320: ...21 REMOTE CONTROLLER REMC 21 20 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...
Page 360: ...24 ON CHIP DEBUGGER DBG 24 6 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...
Page 362: ...25 BASIC EXTERNAL WIRING DIAGRAM 25 2 EPSON S1C17704 TECHNICAL MANUAL THIS PAGE IS BLANK ...