Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
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9
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
LA6 series
recommended solder-pad design for heat dissipation:
LB6 series
recommended solder-pad design for heat dissipation:
7/13
0.
8
0.
7
0.
8
2.
9
0.
3
4.5
1.5 1.5
LB6 series recommended solder pad design for heat dissipation:
1.
5
1.
4
1.
5
5.
2
0.
4
7.4
1.8
3.8
LT6 series recommended solder pad design for heat dissipation:
2.7
0.6
5
2.6
0.7
0.85
1.0
0.3
LMV series recommended solder pad design for heat dissipation:
7/13
0.
8
0.
7
0.
8
2.
9
0.
3
4.5
1.5 1.5
LB6 series recommended solder pad design for heat dissipation:
1.
5
1.
4
1.
5
5.
2
0.
4
7.4
1.8
3.8
LT6 series recommended solder pad design for heat dissipation:
2.7
0.6
5
2.6
0.7
0.85
1.0
0.3
LMV series recommended solder pad design for heat dissipation: