
Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
is a registered trademark and the Cree logo is a trademark of Cree, Inc.
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HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
•
Items to notice before opening the bag:
1.
Check the shelf life (counting from the FQC stamping date on the product label). If the shelf life is over 12 months, re‑baking is
required.
2. Record the lot number of the SMD product to aid investigation.
3. Avoid external damage to the packaging bag after product is taken out of the box. For example, many SMD products are stacked
without box; re‑packing with bubble plastic bag for protection is recommended.
4. Recommendation for product opening and storage: use scissors to cut the bag along the sealing mark in order to re-pack
conveniently for product not to be used within the MSL level floor time.