Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
is a registered trademark and the Cree logo is a trademark of Cree, Inc.
2
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
•
The LED soldering specification is shown below (suitable for both leaded solder & lead‑free solder).
Manual Soldering
Solder Dipping
Soldering iron
35 W max
Preheat
110 ºC max
Temperature
300 ºC max
Preheat time
60 seconds max
Solder-bath temperature
260 ºC Max
Soldering time
3 seconds max
Dipping time
5 seconds max
Position
Not less than 3 mm from the base of the package.
Position
Not less than 3 mm from the base of the package.
•
Manual soldering onto the PCB is not recommended because soldering time is uncontrollable.
•
The recommended wave soldering is as below:
Different lead‑free solder requires different solder conditions. Please contact us for details.
•
Do not apply any stress to the LED package, particularly when heated.
•
It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by the LEDs.
•
The LEDs must not be re used once they have been extracted from PCB.
•
After soldering the LEDs, the package should be protected from mechanical shock or vibration until the LEDs have reached 40 ºC or
below.
•
Precautions must be taken as mechanical stress on the LEDs may be caused by PCB warpage or from the clinching and cutting of
the LED leads.
•
When it is necessary to clam the LEDs during soldering, it is important to ensure no mechanical stress is exerted on the LEDs.
•
Cut the LED lead at normal room temperature. Lead cutting at high temperature may cause failure of the LEDs.
10
20
30
40
50
60
70
80
90
100
110
120
0
30
150
100
300
250
200
50
Te
m
pe
rature
ºC
Times (sec)
laminar wave
Fluxing
Preheat