Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
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12
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
LV6 series
recommended solder-pad design for heat dissipation:
LX6 series
recommended solder-pad design for heat dissipation:
8/13
0.8
0.8
1.9
2.5
1
1
LMU series recommended solder pad design for heat dissipation:
0.
8
0.
8
1.
9
2.5
1
1
LV6 series recommended solder pad design for heat dissipation:
1.
7
5.
65
1.
3
1.
7
0.
47
5
8.2
2.7
2.8
LX6 series recommended solder pad design for heat dissipation:
9/13
LY6 series recommended solder pad design for heat dissipation:
Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications
must be pre-qualified to avoid damaging SMD LED.
Reflow soldering should not be done more than one time.
No stress should be exerted on the package during soldering.
The PCB should not be wrapped after soldering to allow natural cooling down to 40ºC.
1.6
1.8
5.0
2.8
0.3
5
0.7
0.7
0.7