Cree LS8, Soldering & Handling, Page: 4 / 19

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HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
• After opening the sealed bag, the SMD LEDs must be stored under the condition ≤30 ºC and ≤60% RH. Under these conditions,
the SMD LEDs must be subjected to reflow within the MSL level floor time after bag opening. Baking is required when this time is
exceeded.
• For baking, place the SMD LEDs in the oven at 75ºC, +/‑5 ºC with a maximum temperature of 80ºC and relative humidity ≤10% RH for
24 hours.
• Take the material out of the packaging bag before baking. Do not open the oven door frequently during the baking process.
• Please refer to the product specifications for more details.
•
4. Soldering
• Reflow soldering should not be done more than two times(according to model’s MSL requirements).
a. Manual soldering by soldering iron
• Since the temperature of manual soldering is not stable, manual soldering by soldering iron is not recommended.
• If manual soldering is necessary, the use of a soldering iron of less than 25 W is recommended, and the temperature of the iron must
be kept below 315 ºC, with soldering time within 2 seconds.
• The resin of the SMD LED should not contact the tip of the soldering iron.
• No mechanical stress should be exerted on the resin portion of the SMD LED during soldering.
• Handling of the SMD LED should be done when the package has been cooled down below 40 ºC. This is to prevent LED failures due
to thermal-mechanical stress during handling.
b. Reflow Soldering
• The temperature profile (1) is as below (for SMD LED CLMXB‑FKA/CLV1A‑FKB/CLV1L‑FKB/CLV6B‑FKB/CLV6D‑FKB/CLX6B‑FKC/
CLX6C‑FKB/CLX6D‑FKB/CLX6E‑FKC/CLX6F‑FKC/CLQ6A‑TKW):
     
      
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Use all SMD besides LP6-NPP1-01-N1
Solder = Sn63-Pb37 Solder = Lead-free
                        
                   
                     
                   
                    
                                     
                     
Only use LP6-NPP1-01-N1
Solder = Low Lead-free
            
          
          
         
           
                   
          
                        

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Melting point
Pre-heat
Reflow
Cooling
Time
Temper
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