Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
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14
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
UHD1110‑FKA
recommended solder pad design for heat dissipation:
LQ6 series
recommended solder pad design for heat dissipation:
Assembly notes:
•
Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications must be
pre‑qualified to avoid damaging the SMD LED.
•
Reflow soldering should not be done more than two times(according to model’s MSL requirements).
•
No stress should be exerted on the package during soldering.
•
The package may be affected by environments & assemblies which contain corrosive substance. Please avoid conditions which may
cause the LEDs to corrode tarnish or discolor.
•
The PCB should not be wrapped after soldering to allow natural cooling down to 40°.
10/15
LY6 series recommended solder pad design for heat dissipation:
LS6 series recommended solder pad design for heat dissipation:
1010 series recommended solder pad design for heat dissipation:
Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications
must be pre-qualified to avoid damaging SMD LED.
11/15
Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications must
be pre-qualified to avoid damaging SMD LED.
Reflow soldering should not be done more than one time.
No stress should be exerted on the package during soldering.
The PCB should not be wrapped after soldering to allow natural cooling down to 40ºC.
5. Important Notes (
Small Top & Mini side 0.8mmSMD product)
The packaging sizes of these SMD products are very small and the resin is still soft after solidification. Users are required
to handle with care, never touch the resin surface of SMD products.
To avoid damaging the product
’
s surface and interior device, it is recommended to choose special nozzle to pick up SMD
products during the process of SMT production. If handling is necessary, take special care when picking up these
products. The following two methods are necessary:
Fig. 1a: For Small Top SMD. Fig. 1b: For Mini side 0.8mm SMD.