Cree LS8, Soldering & Handling, Page: 8 / 19

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8
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
LU6 series recommended solder-pad design for heat dissipation:
Small‑top SMD LM3 series recommended solder-pad design for heat dissipation:
Mini side 0.8‑mm SMD LS8 series recommended solder-pad design for heat dissipation:
Note
Metal area at 1, 2, 3 should not
be less than 16 mm
2
each for
sufficient heat dissipation.
6/13
1.
6
0.
5
2.
0
4
5
3
2
8.4
6
A
1
6.
6
2.
0
2.4 3.0
LU6 series recommended solder pad design for heat dissipation:
4.7
1.65 1.4
0
.8
0
.3
5
9.4
9
.5
4
.0
1
.8
4
5
3
2
6 1
Small Top SMD LM3 series recommended solder pad design for heat dissipation:
Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.
0
9.3
1.3
2.
2
1.55
4.4
1.0
0.9
1.4
3.8
1.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
6/13
1.
6
0.
5
2.
0
4
5
3
2
8.4
6
A
1
6.
6
2.
0
2.4
3.0
LU6 series recommended solder pad design for heat dissipation:
4.7
1.65 1.4
0
.8
0
.3
5
9.4
9
.5
4
.0
1
.8
4
5
3
2
6 1
Small Top SMD LM3 series recommended solder pad design for heat dissipation:
Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.
0
9.3
1.3
2.
2
1.55
4.4
1.0
0.9
1.4
3.8
1.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
6/13
1.
6
0.
5
2.
0
4
5
3
2
8.4
6
A
1
6.
6
2.
0
2.4 3.0
LU6 series recommended solder pad design for heat dissipation:
4.7
1.65 1.4
0
.8
0
.3
5
9.4
9
.5
4
.0
1
.8
4
5
3
2
6 1
Small Top SMD LM3 series recommended solder pad design for heat dissipation:
Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.
0
9.3
1.3
2.
2
1.55
4.4
1.0
0.9
1.4
3.8
1.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
6/13
1.
6
0.
5
2.
0
4
5
3
2
8.4
6
A
1
6.
6
2.
0
2.4 3.0
LU6 series recommended solder pad design for heat dissipation:
4.7
1.65 1.4
0
.8
0
.3
5
9.4
9
.5
4
.0
1
.8
4
5
3
2
6 1
Small Top SMD LM3 series recommended solder pad design for heat dissipation:
Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.
0
9.3
1.3
2.
2
1.55
4.4
1.0
0.9
1.4
3.8
1.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
6/13
1.
6
0.
5
2.
0
4
5
3
2
8.4
6
A
1
6.
6
2.
0
2.4 3.0
LU6 series recommended solder pad design for heat dissipation:
4.7
1.65 1.4
0
.8
0
.3
5
9.4
9
.5
4
.0
1
.8
4
5
3
2
6 1
Small Top SMD LM3 series recommended solder pad design for heat dissipation:
Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.
0
9.3
1.3
2.
2
1.55
4.4
1.0
0.9
1.4
3.8
1.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
6/13
1.
6
0.
5
2.
0
4
5
3
2
8.4
6
A
1
6.
6
2.
0
2.4 3.0
LU6 series recommended solder pad design for heat dissipation:
4.7
1.65 1.4
0
.8
0
.3
5
9.4
9
.5
4
.0
1
.8
4
5
3
2
6 1
Small Top SMD LM3 series recommended solder pad design for heat dissipation:
Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.
0
9.3
1.3
2.
2
1.55
4.4
1.0
0.9
1.4
3.8
1.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.