Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
is a registered trademark and the Cree logo is a trademark of Cree, Inc.
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HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
LY6 series
recommended solder-pad design for heat dissipation:
LS6 series
recommended solder pad design for heat dissipation:
10/15
LY6 series recommended solder pad design for heat dissipation:
LS6 series recommended solder pad design for heat dissipation:
1010 series recommended solder pad design for heat dissipation:
Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications
must be pre-qualified to avoid damaging SMD LED.