Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
is a registered trademark and the Cree logo is a trademark of Cree, Inc.
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HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
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Baking method:
1.
The SMD LED should not be baked within the packaging bag. The baking condition is 75ºC, +/‑5 ºC with a maximum temperature
of 80ºC for 24 hours. The oven door should not be opened frequently during the baking process.
2. Refer to the photo below for a baking model that can help avoid reel deformation.
For small reels
For large reels
3.
Baked products should cool down to 40 ºC in the oven before being removed for use.
6. Electrostatic Discharge and Electrical Overstress
•
Electrostatic discharge (ESD) or electrical overstress (EOS) may damage an SMD LED.
•
Precautions such as ESD wrist straps, ESD shoe straps or antistatic gloves must be worn whenever handling SMD LEDs.
•
All devices, equipment and machinery must be properly grounded.
•
It is recommended to perform electrical test to screen out ESD failures at final inspection.
•
It is important to eliminate the possibility of electrical overstress during circuit design.
7. Heat Management
Heat management of SMD LEDs must be taken into consideration during the design stage of SMD LED applications. The current should
be de‑rated appropriately by referring to the de‑rating curve included in each product specification.