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2.5
Special product risks
2.5.1
Laser radiation risk
Based on level of potential risk of laser radiation, the national standard GB 7247.1-2001 makes classification for
them. Laser class applicable for this laser marking machine depends on operation mode. The followings are
abstract of laser device classification prescribed by the state:
Class 1: safe laser device under reasonable and foreseeable working conditions
Class 2: laser device is emitting visible light at wave length of 400nm-700nm. Generally, avoidance response
including blink reflection provides protection.
Class 3A: safe laser light visible to naked eyes. Generally, avoidance response including blink reflection provides
protection. Harm to naked eyes of other wave lengths will be less Class 1 laser device. Class 3A light beam internal
observation with optical device (e.g. glasses, telescope, and microscope) may be dangerous.
Class 3B: dangerous laser device is to directly and internally see light beam. Generally, observation of diffuse
reflection is safe.
Class 4: laser device with diffuse reflection causes danger. They may possibly cause skin burn, or fire accident.
Great care is required to use this kind of laser device.
2.5.2
Common mode
In the normal operating mode, the laser marking cutting machine equals to Class 4 laser radiation. In this
operating mode, there will harm of laser radiation to eyes and skin; you are required to wear goggles with
antiglare filter.
2.5.2.1
Direct laser
You are required to pay attention to the followings while operating the laser machine:
It is strictly prohibited to directly expose any parts of human body, explosive object and flammable
objects to direct laser;
Note
Personal protective devices shall not be provided together with the laser marking machine.
Note
This machine is a class 4 laser device. Placing high reflection objects (e.g. glass, mirror) in eth
laser working table is prohibited.
Note
Common working mode must ensure:
Laser light route is in safety protection mode;
Correct operation of the laser marking machine;
Materials to be processed have been verified suitable for laser processing with 10.6μm
wave band
