Xsens MTi 1 Series, Руководство пользователя

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MTi 1-series User Manual
Xsens MTi User Manual Repository Hardware Integration Manual
Copyright © 2021 Xsens Page 95
Footprint
The footprint of the MTi 1-series module is similar to a 28-lead Plastic Leaded Chip Carrier
package (JEDEC MO-047). Although it is recommended to solder the MTi 1-series module
directly onto a PCB, it can also be mounted in a compatible PLCC socket (e.g. 8428-21B1-RK of
3M, as used on the MTi 1-series Development Kit). When using a socket, make sure that it
supports the maximum dimensions of the MTi 1-series module as given in
Package Drawing
(note the tolerance of ± 0.1 mm).
Recommended MTi 1-series module footprint