Xsens MTi 1 Series, Руководство пользователя

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MTi 1-series User Manual
Xsens MTi User Manual Repository Hardware Integration Manual
Copyright © 2021 Xsens Page 97
Handling
For best performance, it is best to solder the module directly onto a PCB by a solder
For best performance, it is best to solder the module directly onto a PCB by a solder
reflow process. When placed in a (PLCC28) socket, the module may be subjected to
reflow process. When placed in a (PLCC28) socket, the module may be subjected to
mechanical stress by the springs in the socket, which might result in deteriorated
mechanical stress by the springs in the socket, which might result in deteriorated
performance.
performance.
Reflow specification
The moisture sensitivity level of the MTi 1-series modules corresponds to JEDEC MSL Level 3,
see also:
IPC/JEDEC J-STD-020E “Joint Industry Standard: Moisture/Reflow Sensitivity Classification
for non-hermetic Solid State Surface Mount Devices”
IPC/JEDEC J-STD-033C “Joint Industry Standard: Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices”.
The sensor fulfils the lead-free soldering requirements of the above-mentioned IPC/JEDEC
standard, i.e. reflow soldering with a peak temperature up to 260 °C. Recommended Preheat
Area (t
s
) is 80-100 sec. The minimum height of the solder after reflow should be at least 50 µm.
This is required for good mechanical decoupling between the MTi 1-series module and the
printed circuit board (PCB) it is mounted on.
The number of times that MEMS components may be reflowed is limited to three times. As the
IMU is already reflowed once by Xsens in order to produce the MTi 1-series module, the MTi 1-
series module may only be reflowed two times when placed on the PCB board. If the MTi 1-
series is designed-in a double-sided PCB, it is recommended to reflow the side with the MTi 1-
series in the second run in order to prevent large offsets.
For automated pick and placement of the MTi 1-series module, please be aware that the
component placement on the module can differ between generations. See Design and
Packaging.