ming process.
See chapter 2 and 3
.
l
An excess of contact adhesive has formed an
insulating layer on the copper rod.
Use a scalpel to clean the copper rod all the
way to the plaster die before applying the con-
ductive silver lacquer.
l
Fault at the anode.
Contact WIELAND TECHNIK or
your authorized dealer.
There are gaps in the surface of the crown coping.
l
The surface to be electroformed was not
properly coated with conductive silver varnish
see chapter 2.
l
The part was in contact with the beaker.
Ensure that there is always an adequate
gap between the plaster die and the beaker.
The plaster dies have fallen off.
l
Either too little or the wrong contact adhesive
was used, or the contact holes were too big.
Ensure that the plaster die is securely fixed
to the copper rod.
l
The conductive silver lacquer was not applied to
the section between the plaster die and the
copper rod, and the copper rod is corroded.
Ensure that approx. 1 cm of conductive
silver lacquer is applied to the copper rod and
that the shrink-fit tubing is applied at a distance
of max. 1 mm from the plaster die.
If the faults cannot be rectified with the aid of these
instructions, please contact WIELAND TECHNIK
or your authorized dealer.
6
6.. P
Po
os
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siib
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e ffa
au
ulltts
s a
an
nd
d ttrro
ou
ub
blle
es
sh
ho
oo
ottiin
ng
g
‡
‡
‡
‡
‡
‡
23
english
Содержание AGC Micro
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