6.3 Connecting the Closed Loop System
Depending on the connection location on the heat load unit, the XDU™ Liquid to Air Heat Exchanger for Chip Cooling offers
top and bottom supply and return connections. See Figure 6.1 below.
Figure 6.2 on the facing page, shows the general arrangement of the isolation valves and trap of the cooling fluid circuit on
a bottom-connected system. A top-connected XDU™ Cooling System would use item 6 as a high point vent for the removal
of air from the system.
Figure 6.1 Top and Bottom Connection Locations
Item
Description
1
Top connections
2
Rear of unit
3
Bottom connections
4
Bottom inlet (EFB)
5
Bottom outlet (LFB)
6
High point vent (air bleed valve)
7
Top outlet (LFT)
8
Top inlet (EFT)
9
Fill connection
10
Pressure ports
Vertiv | XDU™ Liquid to Air Heat Exchanger for Chip Cooling
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Содержание Liebert XDU 060
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Страница 59: ...Appendix B Performance Curves Figure B 1 Liebert XDU Performance Test Results 45 C 113 F LFT 55 ...
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