Universal Laser Systems ULTRA X6000, Руководство пользователя

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ULTRA X6000 Platform Overview 1
The ULTRA X6000 Platform offers laser material processing for the widest possible range of
materials. It is designed and ideally suited for precision material processing in manufacturing,
research and development, academic research, and prototyping environments. With its unique
modular architecture, the platform can be easily reconfigured with a wide array of options for
enhancing performance, capability, and safety to meet present and future business needs.
The ULTRA X6000 Platform has a materials processing envelope of 36 x 24 in. (914 x 610 mm), with
support for materials with a thickness up to 12 in. (305 mm) and may be configured with up to
three laser sources.
When the ULTRA X6000 Platform is configured with two interchangeable CO
2
lasers and one fiber
laser, users may take full advantage of MultiWave Hybrid™ technology, enabling up to three
wavelengths – 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial
beam. In this configuration, each spectral component of the beam is independently controlled and
may be modulated in real time.
Major features include multiple laser support, rapid high-accuracy laser beam positioning, precision
material-independent autofocus, controllable laser power density, an automation interface,
intelligent camera registration, an integrated touch screen control panel, over-temperature
detection, and support for fire suppression.