8
SLOS758G – DECEMBER 2011 – REVISED MARCH 2020
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Specifications
Copyright © 2011–2020, Texas Instruments Incorporated
(1)
Stresses beyond those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating
Conditions
are not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to substrate ground terminal VSS.
(3)
The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability or lifetime of the device.
5
Specifications
5.1
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
(2)
MIN
MAX
UNIT
Input voltage range, V
IN
–0.3
6
V
Maximum current, I
IN
150
mA
Maximum operating virtual junction temperature, T
J
(3)
Any condition
140
°C
Continuous operation, long-term reliability
125
Storage temperature, T
STG
–55
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
5.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22
‑
C101
(2)
±500
Machine model (MM)
±200
5.3
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
V
IN
Operating input voltage
2.7
5
5.5
V
T
A
Operating ambient temperature
–25
25
85
°C
T
J
Operating virtual junction temperature
–25
25
125
°C
