8.13 Thermal Resistance Characteristics for MOB and MON Packages
NAME
DESCRIPTION
AIR FLOW (m/s)
RΘ
JC
Junction-to-case
11.4
0.00
RΘ
JB
Junction-to-board
8.0
0.00
RΘ
JA
Junction-to-free air
18.7
0.00
Psi
JT
Junction-to-package top
5.3
0.00
Psi
JB
Junction-to-board
7.7
0.00
(1)
°C/W = degrees Celsius per watt.
(2)
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ
JC
] value, which is based on
a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
•
JESD51-2,
Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
•
JESD51-3,
Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-7,
High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-9,
Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70°C is assumed.
(3)
m/s = meters per second.
8.14 Timing and Switching Characteristics
8.14.1 Power-Up Sequencing
For proper start-up of the CC3220MODx and CC3220MODAx modules, perform the recommended power-up
sequencing as follows:
1. Tie V
BAT1
(pin 37) and V
BAT2
(pin 40) together on the board.
2. Hold the nRESET pin low while the supplies are ramping up.
shows the reset timing diagram for the first-time power-up and reset removal.
POWER
OFF
HW INIT
FW INIT
APP CODE
EXECUTION
VBAT
nRESET
STATE
T1
T2
T3
RESET
T4
32-kHz
RTC CLK
APP CODE
LOAD
Figure 8-6. First-Time Power-Up and Reset Removal Timing Diagram
SWRS206E – MARCH 2017 – REVISED MAY 2021
36
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