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ADS7950, ADS7951, ADS7952, ADS7953, ADS7954, ADS7955
ADS7956, ADS7957, ADS7958, ADS7959, ADS7960, ADS7961
SLAS605C – JUNE 2008 – REVISED JULY 2018
Product Folder Links:
ADS7950 ADS7951 ADS7952 ADS7953 ADS7954 ADS7955 ADS7956 ADS7957 ADS7958
Copyright © 2008–2018, Texas Instruments Incorporated
(1)
For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics
application
report.
7.4 Thermal Information: TSSOP
THERMAL METRIC
(1)
ADS795x
UNIT
DBT (TSSOP)
DBT (TSSOP)
38 PINS
30 PINS
R
θ
JA
Junction-to-ambient thermal resistance
83.6
89.8
°C/W
R
θ
JC(top)
Junction-to-case (top) thermal resistance
29.8
22.9
°C/W
R
θ
JB
Junction-to-board thermal resistance
44.7
43.1
°C/W
ψ
JT
Junction-to-top characterization parameter
2.9
0.8
°C/W
ψ
JB
Junction-to-board characterization parameter
44.1
42.5
°C/W
R
θ
JC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics
application
report.
7.5 Thermal Information: VQFN
THERMAL METRIC
(1)
ADS7953, ADS7957, ADS7961
UNIT
RHB (VQFN)
RGE (VQFN)
32 PINS
24 PINS
R
θ
JA
Junction-to-ambient thermal resistance
40.6
36.9
°C/W
R
θ
JC(top)
Junction-to-case (top) thermal resistance
32.1
39.3
°C/W
R
θ
JB
Junction-to-board thermal resistance
13.1
14.7
°C/W
ψ
JT
Junction-to-top characterization parameter
0.8
0.7
°C/W
ψ
JB
Junction-to-board characterization parameter
13
14.8
°C/W
R
θ
JC(bot)
Junction-to-case (bottom) thermal resistance
5.7
5.6
°C/W