SE867-AGPS User Guide
1VV0300860 Rev. 3 - 2010-05-10
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 26 of 69
8.
Mounting the SE867-AGPS on the application board
The Telit SE867-AGPS module has been designed in order to be compliant with a
ard lead-free SMT process.
8.1.
es layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil
≥
120
μ
m.
8.2.
PCB pad design
"Non solder mask defined” (NSMD) type is recommended for the solder pads on the
PCB.
stand
Stencil
Stencil’s apertur
Recommendations for PCB pad dimensions