ME310G1 Hardware Design Guide
1VV0301588 Rev. 16
Page 69 of 95
2021-10-27
Not Subject to NDA
10.2
PCB Pad Design
The recommended PCB solder type is Non-solder mask defined (NSMD).
Figure 26: PCB solder pad recommendations
Recommended dimensions for PCB pads are 1:1, including the module pads.
It is not recommended to place via or micro-vias not covered by the solder resist in an
area of 0.3 mm around the pads unless they are transmitting the same signal as the pad
itself
Through holes in the pad are not allowed, only blind holes are allowed.
Recommended PCB pad surface:
Finish
Layer Thickness (um)
Properties
Electro-less Ni /
Immersion Au
3
–
7 / 0.03
–
0.15
good solder ability protection, high shear force values
Table 42 Recommended PCB pad surface
The PCB must be able to resist the high temperatures that occur during the lead-free
process. This issue should be discussed with the PCB supplier. For best surface plating
wettability, tin-lead solder paste must be used in place of lead-free solder paste.
It is not mandatory to panel the PCB of the application. If required, it is recommended to
use milled contours and pre-drilled board breakouts. It is not recommended to use
scoring or v-cut solutions.
10.3
Stencil
The layout of the stencil apertures can be the same as the recommended footprint (1:1).
The recommended stencil foil thickness must be
≥
120 µm.