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ME310G1 Hardware Design Guide
1VV0301588 Rev. 16
Page 70 of 95
2021-10-27
Not Subject to NDA
10.4
Solder Paste
Item
Lead Free
Solder Paste
Sn/Ag/Cu
Table 43: Solder paste
We recommend using only
“no
-
clean” solder paste to avoid cleaning of the modules after
assembly.
10.5
Solder Reflow
Recommended solder reflow profile:
Figure 27: Recommended Solder reflow profile
Warning: The solder reflow profile represents the typical SAC reflow
limits. It does not guarantee the proper adherence of the module to
the customer
’s
application throughout the temperature range. The
customer must optimize the reflow profile based on the factors such
as thermal mass and warpage.
Profile Feature
Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
)
3°C/second max
Preheat
–
Temperature Min (Tsmin)
–
Temperature Max (Tsmax)
–
Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
–
Ramp-up Rate
3°C/second max