TE Connectivity SGI 1.25, Спецификация приложения

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114-106497
Rev 5
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3.14. Soldering
A. Process
The contacts can be soldered using reflow soldering or equivalent soldering techniques. Temperature and
exposure time shall be as specified in 108-106451.
B. Flux Selection
The contact Stabilizer Barrel must be fluxed prior to soldering with a rosin base flux. Selection of the flux
will depend on the type of PC board and other components mounted on the board. Additionally, the flux
must be compatible with the wave solder line, manufacturing, health, and safety requirements. Call the
number at the bottom of page 1 for consideration of other types of flux. Flux that is compatible with these
connectors are provided in Figure 13.
TYPE ACTIVITY RESIDUE
COMMERCIAL DESIGNATION
ALPHA KESTER
RMA (Mildly Activated) Mild Noncorrosive 611 186
Figure 13
C. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder and flux for recommended cleaning solvents. Cleaners must be free of dissolved flux and other
contaminants. It is recommended that cleaning takes place with the PC board on its edge. If using an
aqueous cleaner, it is recommended using standard equipment, such as a soak tank or automatic in-line
machine. Common cleaning solvents with times and temperatures that will not affect these contacts is
specified in Figure 14.
NOTE
For solvents not listed, call the number on the bottom of page 1 for recommendations.
CLEANER
TIME (Minutes) TEMPERATURE (Max)
NAME TYPE
ALPHA 2110 Aqueous 1 132 ° C [270°F]
BIOACT EC-7 Solvent 5 100°C [212°F]
Butyl CARBITOL Solvent 1 Ambient Room
Isopropyl Alcohol Solvent
5 100°C [212°F]
KESTER 5778 Aqueous
KESTER 5779 Aqueous
LONCOTERGE 520 Aqueous
LONCOTERGE 530 Aqueous
Terpene Solvent
Figure 14
D. Drying
When drying cleaned contacts and PC boards, temperature limitations must not be exceeded: -55° to
105°C [-67° to 221°F]. Excessive temperatures may cause contact degradation.