114-106497
Rev 5
18
of 22
Figure 11
3.10.
PC Board
The PC board pads must be solderable in accordance with EIA-638(Electronic Industries Alliance).
Recommended PC board pad pattern, dimensions and tolerances are shown in customer drawing.
3.11.
PC Board Header Assembly Placement
CAUTION
If connectors are placed on the board manually, the connector should be handled only by housing to avoid deformation,
contamination, or damage to the contact solder tines and metal pegs.
A.
Manual Placement
When placing the Surface Mount Connectors, the contact solder tines should be centered on the PC
board circuit pads. However, slight misalignment is permissible as shown in Figure 12.
Figure 12
B.
Robotic Placement
The robotic equipment must be adjusted to feed, pick up, and place the headers on the PC board with an
accuracy as required. The header assembly datum surfaces detailed on the customer drawing will ensure
correct placement of the header.
3.12.
Replacement and Repair
Do not use defective or damaged product. These products cannot be repaired. For replacement information,
call the number at the bottom of page 1.
3.13.
Strain Relief and Wire Dress
Wires can be bundled together and supported using cable ties or electrical tap. The wires must remain
perpendicular to the housing and avoid an excessively sharp bend radius. The wire bundle must be at least
76mm [3.0 inch] from the back of the housing before bending in any direction. Do not bend unsupported wires
as this may cause strain on the contacts.
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