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Package characteristics
ST7LITEUS2, ST7LITEUS5
122/136
13.2 Thermal
characteristics
Table 74.
Thermal characteristics
Symbol
Ratings
Value
Unit
R
thJA
Package thermal resistance
(junction to ambient)
Plastic DIP8
82
°C/W
SO8
130
DFN8 (on 4-layer
PCB)
DFN8 (on 2-layer
PCB)
50
106
T
Jmax
Maximum junction
temperature
(1)
1.
The maximum chip-junction temperature is based on technology characteristics.
150
°C
P
Dmax
Power dissipation
(2)
2.
The maximum power dissipation is obtained from the formula P
D
= (T
J
-T
A
) / R
thJA
.
The power dissipation of an application can be defined by the user with the formula: P
D
=P
INT
+P
PORT
where P
INT
is the chip internal power (I
DD
x V
DD
) and P
PORT
is the port power dissipation depending on the
ports used in the application.
Plastic DIP8
300
mW
SO8
180
DFN8 (on 4-layer
PCB)
500
DFN8 (on 2-layer
PCB)
250
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