— 2 —
TABLE OF CONTENTS
1. GENERAL
.......................................................................... 3
2. DISASSEMBLY
2-1. Battery Case LID (Handset) ........................................ 17
2-2. Cabinet (Rear) (Handset) ............................................. 17
2-3. Hand Main Board (Handset) ....................................... 17
2-4. Cabinet and Boards (Base Unit) .................................. 17
3. 900 MHz SYSTEM OPERATION
3-1. Access Method ............................................................ 18
3-2. Protocol ....................................................................... 18
4. TEST MODE
4-1. Base Unit Test Mode A ................................................ 21
4-2. Base Unit Test Mode B ................................................ 22
4-3. Base Unit Test Mode ................................................... 23
4-4. Handset Test Mode ...................................................... 25
4-5. RF Testing Mode ......................................................... 27
5. ELECTRICAL ADJUSTMENTS
5-1. Base Unit Section ........................................................ 30
5-2. Handset Section ........................................................... 31
6. DIAGRAMS
6-1. IC Block Diagrams ...................................................... 34
6-2. Block Diagram –Base Unit (Main) Section– .............. 35
–Handset Section– ....................................................... 37
6-3. Printed Wiring Board –Base Main Section– ............... 39
6-4. Schematic Diagrams –Base Unit Section (1/2)– ......... 41
6-5. Schematic Diagrams –Base Unit Section (2/2)– ......... 43
6-6. Printed Wiring Board –Base Key Section– ................. 45
6-7. Schematic Diagram – Base Key Section – .................. 47
6-8. Printed Wiring Board –Display Section– .................... 49
6-9. Schematic Diagram –Disp Section– ............................ 51
6-10. Printed Wiring Board –Hand Main Section– .............. 53
6-11. Schematic Diagram –Hand Main Section– ................. 55
6-12. IC Pin Functions .......................................................... 57
7. EXPLODED VIEWS
7-1. Handset Section ........................................................... 62
7-2. Base Unit Section ........................................................ 63
8. ELECTRICAL PARTS LIST
........................................ 64
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE
WITH MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
!
SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS
SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.
Содержание SPP-A9171 - Cordless Telephone With Answering Machine
Страница 38: ...SPP A9171 41 42 6 4 SCHEMATIC DIAGRAM BASE MAIN SECTION 1 2 See page 33 for Note on Schematic Diagrams ...
Страница 39: ...SPP A9171 43 44 6 5 SCHEMATIC DIAGRAM BASE MAIN SECTION 2 2 See page 33 for Note on Schematic Diagrams ...
Страница 41: ...SPP A9171 47 48 6 7 SCHEMATIC DIAGRAM BASE KEY SECTION See page 33 for Note on Schematic Diagrams ...
Страница 43: ...SPP A9171 51 52 6 9 SCHEMATIC DIAGRAM DISPLAY SECTION See page 33 for Note on Schematic Diagrams ...
Страница 45: ...SPP A9171 55 56 6 11 SCHEMATIC DIAGRAM HAND MAIN SECTION See page 33 for Note on Schematic Diagrams ...
