Hardware
Configuration and Assembly
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Interference infiltrating the system through the power supply and/or protective
ground
Interference can impair the fault-free functioning of the SIWAREX MS.
4.2.4 Coupling
Mechanisms
Depending on the means of distribution (conductive or non-conductive bound) and
the distance between the interference source and the device, interference can be
introduced into the automation system through four different coupling mechanisms.
Galvanic coupling
Capacitive coupling
Inductive coupling
Radiation coupling
4.2.5
Five Basic Rules for Guaranteeing EMC
If you follow these five basic rules, EMC can be guaranteed in most cases!
Rule 1: Large surface area grounding connection
Ensure that while installing the automation devices, a well-made large surface area
ground connection is made between the inactive metal components (see following
sections).
Connect all inactive metal components and low-impedance components with
ground (broad cross-section).
Use screwed connections on painted or anodized metal surfaces either with
special contact washers or remove the insulated protective surface at the contact
points.
Do not use aluminum components for ground connections if at all possible.
Aluminum oxidizes easily and is therefore less suitable for grounding connections.
Find a central location for connections between the grounding point and the ground
wiring system.
Rule 2: Proper wiring
Separate the cabling into groups (high-voltage lines, power supply lines, signal
lines, ground wiring, data lines etc.).
Run the high-voltage lines and ground wiring or data cables in separate channels
or bundles.
Run measurement lines as close to grounding surfaces as possible (e.g. support
beams, metal rails, cabinet panels).
4-10 SIWAREX
MS
