Product Specifications
2-6
Samsung Electronics
Changed
part
Changed item
and feature
Basic
After changed
Main PCB
Change Main PCB
- Increase MICOM capability
FAN PCB
Applies 600V IPM by LC
resonance buck-converter
Inverter PCB
(Compressor
Control
PCB)
- Increases current due to
high capacity compressor
- Increases capacitor's capacity
- Applies EMI coil on board
(Deletes core in wire)
EMI PCB
- Develops 50A EMI PBA
ױ
Increases coil size and
fuse capacity
- Improves EMI characteristic.
REACTOR
- Increases current due to
high capacity compressor
- Improved wire connection terminal
Refrigerant
cooling
- Increases heat cooling capacity
- Increases pipe size and heat
exchange area
Changes in comparison to basic mode
(cont.)
Q
AM140/160/180/200/220/240/260/280/300KXV
666
Содержание DVM S AM080FXVAGH
Страница 15: ...Samsung Electronics 2 9 2 1 3 Structure of product Heat Pump AM6666XV66H Series Small size Large size ...
Страница 199: ...Samsung Electronics 5 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 5 PCB Diagram and Parts List 5 1 ASS Y PCB MAIN ...
Страница 202: ...5 4 Samsung Electronics 5 2 ASS YPCBMAIN HUB ŶAC 1 2 3 4 5 6 7 8 9 10 11 12 ...
Страница 204: ...PCB Diagram and Parts List 5 6 Samsung Electronics ASS YPCBMAIN HUB cont ŶDC 1 1 2 3 4 5 6 7 8 9 10 11 ...
Страница 210: ...5 12 Samsung Electronics 5 4 ASS YPCBFAN Model 1 FANchassis 1 5 2 6 3 4 ...
Страница 212: ...5 14 Samsung Electronics ASS YPCBFAN cont Model 2 FAN chassis 1 7 2 8 3 4 5 9 6 ...
Страница 253: ...8 12 Samsung Electronics 8 3 How to check the view mode using a tact switch 㽞 AM080ί2606XV666 rX rY rZ r ...