106
V530-R2000
User’s Manual
SECTION 9
Appendix
Le
ns
a
nd Light
in
g
SECTION 9
Not Using a Reading Head
If using a Reading Head cannot provide the required field of vision or working distance
or if the amount of light is insufficient, use the following information to select the lighting
and lens.
n
Selecting the Lighting
Material
Processing
Description
Cross-section
External
lighting
Precau-
tions
Transparent
material
Metal depo-
sition
Codes formed by metal dispo-
sition on a transparent mate-
rial
Through
lighting
Make back-
ground
darker.
Coaxial
lighting
Front sur-
face scribed
Codes formed by carving the
front surface of a transparent
material
Coaxial
lighting
Inner mark-
ing
Codes formed inside a trans-
parent material
Ring lighting
Back sur-
face scribed
Codes formed by carving the
back surface of a transparent
material
Ring lighting
Wafers
-
Codes formed on the surface
of wafers by laser, e.g., SEMI-
T7
-
-
Metal Mirror
sur-
face (pro-
cessed)
Codes formed by laser or
other method on cut or pol-
ished surfaces
Ring lighting
-
Rough sur-
face (cast
surface)
Codes formed by pin stamp-
ing or other method on cast
surfaces
Ring lighting
-
Plated or
painted sur-
face
-
Codes formed by removing
metal plating, resin, or other
coating with a laser or other
method
-
Ring lighting
-
Resin Colored
sur-
face
Codes formed by using a laser
to change the color of a resin
Ring lighting
-
Substrate Peeled
resist sur-
face
Codes formed by removing
resist from a substrate with a
laser or other method
Ring lighting
-
Transparent
material
Wafers
Metal
Resin
Содержание V530-R2000
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