µ
PD78C14(A)
47
8. RECOMMENDED SOLDERING CONDITIONS
Solder the
µ
PD78C14(A) under the recommended conditions listed below.
For details of the recommended conditions for soldering, please refer to Semiconductor Device Mounting Technology
Manual (IEI-1207).
Consult an NEC sales representative about soldering methods and soldering conditions other than listed below.
Table 8-1. Soldering Conditions for Surface Mount Type
(1)
µ
PD78C14GF(A)-xxx-3BE: 64-pin plastic QFP (14 x 20 mm)
Soldering Method Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235 ˚C, Time: Within 30 s (at 210 ˚C or higher),
IR35-00-2
Count: Twice or less
<Attention>
(1) Perform the second reflow when the device temperature has come down
to the room temperature from the heating from the first reflow.
(2) Do not wash the soldered portion with the flux following the first reflow.
VPS
Package peak temperature: 215 ˚C, Time: Within 40 s (at 200 ˚C or higher),
VP15-00-2
Count: Twice or less
<Attention>
(1) Perform the second reflow when the device temperature has come down
to the room temperature from the heating from the first reflow.
(2) Do not wash the soldered portion with the flux following the first reflow.
Wave soldering
Soldering bath temperature: 260 ˚C or less, Time: Within 10 s,
WS60-00-1
Count: Once, Preheating temperature: 120 ˚C MAX.
(package surface temperature)
Partial heating
Pin temperature: 300 ˚C or less, Time: Within 3 s (per pin row)
—
Caution Do not use several soldering methods together (except partial heating).
(2)
µ
PD78C14L (A)-xxx: 68-pin plastic QFJ (950 x 950 mil)
Soldering Method Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 230 ˚C, Time: Within 30 s (at 210 ˚C or higher),
IR30-107-1
Count: Once, Maximum number of days: Seven
Note
(after seven days,
prebaking at 125 ˚C is required for 10 hours)
VPS
Package peak temperature: 215 ˚C, Time: Within 40 s (at 200 ˚C or higher),
VP15-107-1
Count: Once, Maximum number of days: Seven
Note
(after seven days,
prebaking at 125 ˚C is required for 10 hours)
Partial heating
Pin temperature: 300 ˚C or less, Time: Within 3 s (per pin row)
—
Note
Number of storage days under the storage conditions of 25 ˚C and 65 % RH or less after the dry pack is opened.
Caution
Do not use several soldering methods together (except partial heating).
*
*