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PN6280_Hardware Design



The highest temperature can’t too high. In the condition that meet the welding quality of customer

motherboard and module, the lower furnace temperature and the shorter maximum temperature

time, the better.

Some

customer’s temperature curve in the line is not suitable, high temperature is too high, and

customer motherboard melt good, but non-performing rate is on the high side. Through the analysis

of the causes, it found that melt again of BGA components lead device offset and short circuit. After

adjusting the temperature curve, it can

ensure that the customer’s motherboard the welding quality,

and also improve the pass through rate. Non-performing rate is controlled below the 2/10000.

6.2.3 SMT stencil design and the problem of less tin soldering

Part of customers found false welding or circuit short when reflowing. The main reason is module tin

less, PCB distortion or tins too large. Suggestions are as follows:



Suggest use ladder stencil, which means the depth of the region of module is thicker than other

areas. Please adjust validation according to the measured thickness of solder paste, the actual

company conditions and experience value. The products need to strictly test.



Stencil: Reference module package, and the user can adjust according to their company

experience; Outside of the module, the stencil extends outside. The GND pads use the net stencil.

6.2.4 SMT attentions

If customer motherboard is thin and slender with a furnace deformation, warping risks, you will be

suggested to create "a furnace vehicle" to ensure the welding quality. Other production proposals are

as follows:



The solder pastes use brands like Alfa.



The module must use the SMT machine mount (important), and do not recommend manually

placed or manual welding.

Содержание PN6280

Страница 1: ...PN6280_Hardware Design Copyright JSC NIIMA PROGRESS and NAVIA LLC 0 Progress NAVIA PN6280 Hardware Design User Manual V1 0 RUSSIA 2019 ...

Страница 2: ...hers and the using or communication of the contents thereof are forbidden without express authority Offenders are liable to the payment of damages All rights reserved in the event of grant of patent or the registration of a utility model or design All specification supplied herein are subject to change without notice at any time DISCLAIMER ALL CONTENTS OF THIS MANUAL ARE PROVIDED AS IS EXCEPT AS R...

Страница 3: ...4 3 1 2 Power pin description 15 3 1 3 Hardware power on off 15 3 1 4 Hardware reset 16 3 2 USIM INTERFACE 16 3 2 1 Pin description 16 3 2 2 USIM application 17 3 3 USB INTERFACE 17 3 4 PCM INTERFACE 19 3 5 IIC INTERFACE 20 3 6 UART INTERFACE 20 3 6 1 Pin description 20 3 6 2 UART application 21 3 7 INTERACTIVE APPLICATION INTERFACE 22 3 8 LED INTERFACE 23 3 8 1 LED control circuit 23 3 8 2 LED st...

Страница 4: ...RF FEATURES 30 5 1 FREQUENCY BAND 30 5 2 DATA LINK 31 5 3 ANTENNA DESIGN 31 6 STORAGE AND PRODUCTION 34 6 1 STORAGE 34 6 2 PRODUCTION 34 6 2 1 Module confirmation and moisture 35 6 2 2 SMT reflow attentions 36 6 2 3 SMT stencil design and the problem of less tin soldering 37 6 2 4 SMT attentions 37 7 SAFETY INFORMATION 39 ...

Страница 5: ...ss internet access module which has the advantages of fast Internet access speed small size light weight and high reliability It can be widely used in various products and devices with wireless internet access function 1 1 Hardware Diagram Figure 1 1 PN6280 functional architecture 1 2 Main Features CPU ARM Cortex R4 481MHz ...

Страница 6: ...1800 MHZ WCDMA UMTS900 MHZ UMTS2100 MHZ 1 3 Specifications Supply Voltage Range 3 3 4 2V type 3 8V Dimensions 29 5mm 19 5mm 2 65mm Package 90 pin LGA Operation Temperature Range 40 85 Storage Temperature Range 45 90 Antenna Main Antenna Weight Approx 3 5g 1 4 Interfaces IIC GPIO PCM Digital audio interface SIM Support 1 8V 3V UART High speed UART USB 2 0 High Speed 480Mbps ...

Страница 7: ...6 3 5 3 4 3 3 3 2 G N D M A IN _A N T G N D G N D G P IO 5 1 G P IO 5 2 N ET LIG H T G P IO 4 6 I2 C _S C L I2 C _S D A G N D 6 2 6 1 6 0 5 9 5 8 5 7 5 6 5 5 5 4 5 3 5 2 5 1 5 0 4 9 4 8 4 7 4 6 4 5 4 4 4 3 G N D N C N C G P IO 1 7 T X _E N G N D U A R T 0_D T R U A R T 0_T X D U A R T 0_D C D U A R T 0_R I U A R T 0_R X D U A R T 0_C T S U A R T 0_R T S G P IO 4 8 G P IO 4 7 G N D G N D V B A T V ...

Страница 8: ...ND 8 USIM_DATA I O USIM data DVDD18 Open 9 USIM_RST O USIM reset DVDD18 Open 10 USIM_CLK O USIM clock DVDD18 Open 11 USIM_VDD P USIM output voltage 1 8 3 0V Open 12 GND G Ground GND 13 PCM_CLK I O PCM interface clock DVDD18 Open 14 PCM_SYNC I O PCM interface sync DVDD18 Open 15 PCM_IN I O PCM I F data in DVDD18 Open 16 PCM_OUT I O PCM I F data out DVDD18 Open 17 GND G Ground GND 18 U1RXD DI UART1 ...

Страница 9: ...input output PIN It can be used as I2C data DVDD18 Open 34 I2C_SCL I O General input output PIN It can be used as I2C clock DVDD18 Open 35 GPIO46 I O General input output PIN DVDD18 Open 36 NETLIGHT O Output PIN as LED control for network status DVDD18 Open 37 GPIO52 I O General input output PIN DVDD18 Open 38 GPIO51 I O General input output PIN DVDD18 Open 39 GND G Ground GND 40 GND G Ground GND ...

Страница 10: ...T0_RI DO UART0 ring indicator DVDD18 Open 54 UART0_DCD DO UART0 data carrier detect DVDD18 Open 55 UART0_TXD DO UART0 transmit output DVDD18 Open 56 UART0_DTR DI UART0 Data terminal ready DVDD18 Open 57 GND G Ground GND 58 TX_EN DO TX Enable signal DVDD18 Open 59 GPIO17 I O General input output PIN DVDD18 Open 60 NC NC 61 NC NC 62 GND G Ground GND 63 GND G Ground GND 64 GND G Ground GND 65 GND G G...

Страница 11: ...ND 81 GND G Ground GND 82 GND G Ground GND 83 GND G Ground GND 84 GND G Ground GND 85 GND G Ground GND 86 GND G Ground GND 87 GND G Ground GND 88 GND G Ground GND 89 GND G Ground GND 90 GND G Ground GND 1 Suggested status when not in use Notes All IO ports module provides need to be out of floating in the boot process If the IO is pulled up by the external voltage before booting it may cause the m...

Страница 12: ...ption P POWER G GROUND I INPUT DI DIGITAL INPUT O OUTPUT DO DIGITAL OUTPUT ANT ANTENNA DIO DIGITAL INPUT OUTPUT NC NOT CONNECT 2 3 Package Information 2 3 1 Dimensions The PN6280 mechanical dimensions are described as following figure Top view Back view Side view Figure 2 2 Mechanical Dimensions ...

Страница 13: ...labeling Figure 2 3 Label of PN6280 Table 2 3 Description of label Item Description A Pin1 mark B Logo of companies C Module name model D QR code include IMEI number E WEEE F IMEI number G SN number H Module description 2G 3G module I QR code include SN number J CE certification mark ...

Страница 14: ...PN6280_Hardware Design Copyright JSC NIIMA PROGRESS and NAVIA LLC 13 2 3 3 Module size Figure 2 4 Module Size Unit mm 2 3 4 Recommend decal Figure 2 5 Recommend pad front view unti mm ...

Страница 15: ... 2A A large capacitor voltage is recommended to use near VBAT pins and the capacitor s value is the bigger the better In order to improve the continued flow of large current it is recommended to use a low impedance tantalum 470uF or larger During layout the capacitors are close to the VBAT pins Figure 3 1 Power Supply circuit Notes According to the environment please select capacitor as large valu...

Страница 16: ... performance of the product In addition there are a total of 28 63 90 heat sink and fixed ground pad 3 1 3 Hardware power on off Module second pin is the Power on off key Pulling down the PWRKEY continuously the module will boot Releasing the PWRKEY the module will shutdown There is internally pulled up resistor If using the power on the boot form and the PWRKEY is grounded directly If you do not ...

Страница 17: ... Interface 3 2 1 Pin description PN6280 supports and be able to automatically detect 3 0V and 1 8V USIM card USIM card interface signal as shown in table 3 1 Table 3 1 U SIM Pin Description Pin NO Pin Name Signal definition Function Description 8 USIM_DATA USIM card data pin USIM card DATA signal I O signal 9 USIM_RST USIM card reset pin USIM card reset signal output by the module 10 USIM_CLK USIM...

Страница 18: ...o long resulting in serious waveform distortion affecting the signal integrity USIM_CLK and USIM_DATA signals are recommended to be protected Between GND and USIM_VDD in parallel with a 1uF and 33pF capacitors that can filter out the interference of radio frequency signals Figure 3 4 U SIM Circuit 3 3 USB Interface USB application The USB interface of the module conforms to the USB2 0 specificatio...

Страница 19: ... The differential impedance of differential data lines should be controlled at 90ohm 10 and lines should be protected up and down and can t be crossed with other lines USB connection circuit is as follows Figure 3 6 USB Circuit Note If you use the serial port communication the DM DP reserved test points respectively in order to download software If DM DP is used to communicate with the MCU the pos...

Страница 20: ... device PCM sync PCM CLK are as output pins and PCM sync output 16kHz synchronization signals the PCM data support 8 bit or 16 bit data format We recommended codec chip is NAU8814YG The codec chip crystal default use 1 8V power supply 12M output active crystal The power control pin of the PCM uses the PIN35 by default And NAU8814YG connected circuit from the device is shown in figure 3 7 Figure 3 ...

Страница 21: ...nchronous communication interface supporting standard modem handshake signal control and in compliance with the RS 232 interface protocol also supporting 4 wire serial bus interface or 2 wire serial bus interface mode The module can communicate AT commands by UART interfaces The two groups of UART ports support programmable data width stop bits and parity bits with separate TX and Rx FIFOs 512 byt...

Страница 22: ...s We suggest that the users retain this interface and set aside the test point If used in communication between the module and application processor and the level is 1 8V the connection mode is shown in Figure 3 8 and figure 3 9 You can use the complete RS232 mode 4 wires or 2 wires mode connection Module interface level is 1 8V If the AP interface level does not match you must increase the level ...

Страница 23: ...t can be used as wake up interrupt signal to module from host L wake up module H module into sleep If it is unused left open 36 NETLIGHT O Output PIN as LED control for network status If it is unused left open Notes Serial communication the module can enter the sleep USB communication the module can t enter the sleep unplug the USB the module can enter the sleep Note If need to use more GPIO ports...

Страница 24: ...ntrol circuit NETLIGHT GPIO54 PIN36 can be used to control the network status of the lam Figure 3 10 LED Circuit 3 8 2 LED state description NETLIGHT GPIO54 is used as the enable pin Table 3 4 lists the LED status Table 3 4 LED Status LED Status Module Status Always On Searching Network Call Connect ...

Страница 25: ...PN6280_Hardware Design Copyright JSC NIIMA PROGRESS and NAVIA LLC 24 300ms ON 300ms OFF Data Transmit 800ms ON 800ms OFF Registered network OFF Power off Sleep ...

Страница 26: ...it VBAT 3 3 3 8 4 2 V Peak current 0 3 2 0 A 4 2 Temperature Characteristic Table 4 2 Temperature characteristic State Min Nom Max Unit Working 40 25 85 Storage 45 25 90 Notes The over low voltage can t power on the module Over high voltage may be danger to damage the module Using the DCDC supply please ensure the ability of DCDC over 2 0A We don t suggest the LDO as the power supplier ...

Страница 27: ...ting Conditions Table 4 4 Recommended operating range PIN Name Description Min Typ Max Unit DVDD18 Digital power input for IO 1 7 1 8 1 9 V 4 5 Power Consumption Table 4 5 Power Consumption Parameter Conditions Min Average Max Unit Standby current Flight mode Suspend state 1 0 mA Note When the temperature is over the range the RF performance may be dropped It also may cause power down or restart p...

Страница 28: ... only 1 8 mA WCDMA only 1 9 mA USB Fltght mode 21 8 mA GSM900 MAX Power 232 mA DCS1800 MAX Power 172 mA WCDMA CH3012 MAX Power 482 mA WCDMA CH10700 MAX Power 452 mA Peak current Max power mode burst current 2 0 A 4 6 Power Sequence Figure 4 1 Power up time sequence diagram ...

Страница 29: ... VOH High level output voltage 1 62 1 8 1 98 V VOL Low level output voltage 0 0 3 V 4 8 ESD The module contains high sensitive electronic and is an electrostatic Sensitive Device More attentions should be paid to the procedure of handing and packaging The ESD test results are shown in the following table ESD parameter Tem 25 humidity 45 Table 4 7 ESD Performance PIN Name Contact discharge Air disc...

Страница 30: ... edge of the board 3 USB UART and other plug connection need to add ESD devices the other from the outside of the machine out of the control line also need to add ESD devices 4 SIM card users will get inserted t card touch the place also need to add ESD device 5 External antenna please add ESD device ESD Cpf 0 5pF Notes For ESD protect please add ESD methods according to upper ways High speed circ...

Страница 31: ... MHz DCS1800 1710 MHz 1785 MHz 1805 MHz 1880 MHz UMTS2100 1920 MHz 1980 MHz 2110 MHz 2170 MHz UMTS900 880 MHz 915 MHz 925 MHz 960 MHz Table 5 2 Output Power Frequency Max output power Min output power E GSM900 33dBm 2dB 5dBm 5dB DCS1800 30dBm 2dB 0dBm 5dB E GSM900 8 PSK 27dBm 3dB 5dBm 5dB DCS1800 8 PSK 26dBm 3 4dB 0dBm 5dB UMTS2100 24dBm 1 3dB 56dBm 5dB UMTS900 24dBm 1 3dB 56dBm 5dB Table 5 3 Rece...

Страница 32: ...The access part of the RF antenna of this product supports the PAD form The connection between the module and the main board antenna interface is required to be welded and connected through a microstrip line or a strip line The microstrip line or strip line is designed according to the characteristic impedance of 50 ohm and the length of the wire is less than 10mm Reserved matching network Antenna...

Страница 33: ...ery direction of the far field Dipole antenna is perfect as the terminal antenna For built in antenna it is recommended to use PIFA or IFA antennas Antenna dimension 6mm 10mm 100mm H W L Antenna radiation direction omnidirectional Gain and directivity Antenna directivity refers to the intensity of the electromagnetic field while the electromagnetic wave is in all directions Gain is the collection ...

Страница 34: ...2 composition of the antenna matching network for antenna debugging the default R1 R2 paste 0 ohm resistor C2 C1 empty paste to be antenna factory after the antenna to determine the value of the antenna The RF Connector in the figure is reserved for test conduction test e g certified CE FCC etc and should be placed as close as possible to the module The RF path from the module pad to the antenna f...

Страница 35: ... good air circulation Humidity level is descripted detail as follows Table 6 1 Humidity level Rank Factory Environment 30 C 60 RH 1 No controll 30 C 85 RH 2 One year 2a 4 weeks 3 168 hours 4 72 hours 5 48 hours 5a 24 hours 6 Baking before using SMT during the time table signs Notes Moving storage production of module must meet the demand of IPC JEDEC J STD 033 6 2 Production The module is a humidi...

Страница 36: ...ay attention to the moisture control before SMT and the confirmation of the following aspects Demand of Baking confirmation Smart module uses vacuum sealed bag which can make it stored for 6 months under the condition of temp 30 C and humidity 60 The module should be baked before reflowing soldering if any of the conditions below happen 1 Storage exceeds the time limit 2 Package damages and vacuum...

Страница 37: ...he baking time such as 125 C 36 hours 6 2 2 SMT reflow attentions The module has the BGA chips chip resistances and capacitances internally which will melt at high temperature If module melt completely encountered a large shock such as excessive vibration of reflux conveyor belt or hit the board internal components will easily shift or be false welding So using intelligent modules over the furnace...

Страница 38: ...ess tin soldering Part of customers found false welding or circuit short when reflowing The main reason is module tin less PCB distortion or tins too large Suggestions are as follows Suggest use ladder stencil which means the depth of the region of module is thicker than other areas Please adjust validation according to the measured thickness of solder paste the actual company conditions and exper...

Страница 39: ...es and strictly control the furnace temperature curve Recommended temperature B constant temperature zone temperature 160 190 C time 60s 100s E recirculation zone PEAK temperature 235 245 C time over 220 C 30s 60s 图 7 1 炉温曲线 Note customer s board deformation must be controlled well By reducing the number of imposition or increasing patch clamp to reduce the deformation Module thickness of the sten...

Страница 40: ...ochlear implant and heart pacemaker etc Mobile devices can t guarantee to connect in all conditions like no fee or with an invalid SIM card When you need emergent help please remember using emergency calls and make sure your device power on in an area with well signal Put the module away from inflammable gases Switch off the mobile device when close to gas station oil depot chemical plant etc The ...

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