
PN6280_Hardware Design
Copyright © JSC NIIMA PROGRESS and NAVIA LLC
36
Baking time
4 hours
30days
Description
not use the original tray
Can use the original tray
Customer product maintenance
If maintenance module after SMT, it is easy for damp module to damage when removing, so the
module disassembly and other related maintenance operations should complete within 48 hours after
SMT, or need to bake and then maintenance the module.
Because the module return from the field work
can’t ensure the dry state, it must be baked in
accordance with the conditions of baking, then for disassembly and maintenance. If it has been
exposed to the humid environment for a long time, please properly extend the baking time, such as
125
°C /36 hours.
6.2.2 SMT reflow attentions
The module has the BGA chips, chip resistances and capacitances internally, which will melt at high
temperature. If module melt completely encountered a large shock, such as excessive vibration of
reflux conveyor belt or hit the board, internal components will easily shift or be false welding. So, using
intelligent modules over the furnace need to pay attention to:
Modules can’t be vibrate larger, namely customer requirements as far as possible in orbit (chain)
furnace, furnace, avoid on the barbed wire furnace, in order to ensure smooth furnace.
Note: The original anti-ESD tray temperature does not exceed 50
°C
. Otherwise the tray will
be deformed.
The anti-ESD tray of
the original packaging is only used for packaging, and can’t be
used as a SMT tray.
During taking and placing, please take notes of ESD and cannot be placed as overlay.