© National Instruments
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4-11
NI sbRIO-9651 System on Module Carrier Board Design Guide
Mounting Recommendations for Maximizing Thermal
Performance
The sbRIO-9651 SOM includes an integrated heat spreader that uses a thermal gap filler material
to effectively conduct into the spreader the heat that the circuit card assembly components
generate. NI recommends the following mounting procedures for maximizing the thermal
performance of your application:
•
Directly mount the flat and smooth exterior surface of the integrated heat spreader to
a thermally-conductive surface, such as a metal enclosure wall or plate, as shown in
Figure 4-1. An interface material such as thermal grease should be used to maximize the
heat transfer from the integrated heat spreader to the enclosure or plate. The enclosure or
plate conducts and convects the heat to the external ambient environment.
If design limitations prevent this solution, you can alternatively attach a heat sink or other
thermal solution to the integrated heat spreader, as shown in Figure 4-3. This solution takes
advantage of natural convection or forced convection cooling provided by a fan.
•
Mount the sbRIO-9651 SOM vertically with respect gravity to take advantage of natural
convection cooling.
•
Mount the sbRIO-9651 SOM below and away from other heat-dissipating components.
Note
Placing the sbRIO-9651 SOM within a system or enclosure will also
influence thermal performance.
Figure 4-6 shows good, better, and best thermal mounting solutions for the sbRIO-9651 SOM.
Figure 4-6.
Thermal Mounting Solutions Comparison
1
Good
—Horizontal mounting with no additional thermal provisions
2
Better
—Vertical mounting with an attached heat sink, as described in Figure 4-3
3
Best
—Vertical mounting directly to a thermally-conductive wall or plate, as described in Figure 4-1
1
2
3