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ni.com
Chapter 4
Mechanical Considerations
temperature. This alternative method provides a completely digital validation scheme that
does not require using a thermocouple and allows you to validate the sbRIO-9651 SOM as part
of every deployment.
In addition to being useful for system validation, digitally reported temperatures also provide
feedback about system health and can be used as triggers or set points. The TEMP_ALERT
signal from the J1 connector on the sbRIO-9651 SOM asserts when the CPU/FPGA or Primary
System reported temperatures exceed specification. However, you should not use the
TEMP_ALERT signal in place of proper system validation because the TEMP_ALERT signal
does not monitor the Secondary System or local ambient temperatures. Refer to the
section of Chapter 1,
, for more information about the TEMP_ALERT
signal.
NI recommends that you monitor the digitally reported temperatures on deployed systems,
especially if the temperatures approach the maximum thermal specifications during system
validation testing. Monitoring allows individual systems to identify adverse thermal changes
caused by differences in environmental, operating, or process conditions.
For more information about how to access and use the digitally reported temperature sensor
measurements, visit
ni.com/info
and enter the Info Code
sbriosensors
.
Managing Power and Feature Utilization
An sbRIO-9651 SOM that heavily utilizes all of its performance and features consumes and
dissipates substantially more power than when the device is idle. Certain features, such as LVDS
outputs, can greatly increase the power that the Xilinx Zynq SoC dissipates and therefore also
quickly raise the die junction temperature.
Consider the following options for reducing the die junction temperature:
•
Design for additional thermal cooling that can appropriately dissipate power
•
Reduce device feature utilization
Note
Your final validation must consider software and hardware utilization that is
representative of the final deployment conditions.
Note
Refer to the
Input Power Requirements
section of the
NI sbRIO-9651 System
on Module OEM Device Specifications
for specifications that approximate the
maximum power requirement for each input rail on an sbRIO-9651 SOM with
worst-case silicon manufacturing process and maximum junction temperatures.
For a more accurate estimate of the power consumption for a specific application,
NI recommends that you directly measure the power the sbRIO-9651 SOM
consumes when running your application in an environment that is representative
of the intended use case. You can use the Xilinx Power Estimator to calculate the
VIO_BANK input rail power for a given configuration.