Miyachi Unitek 1-292-01, Руководство оператора

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CHAPTER 3: USING UNIFLOW
®
2 PROGRAMMING FUNCTIONS
UNIFLOW
®
2 PULSED THERMODE CONTROL
3-2 990-228
Setup Mode
Press the
SETUP
key to enter the setup mode. In
the setup mode, the display presents system
setup options for you to select.
For details, refer to SETUP Key later in this
chapter.
< SETUP MENU >
1. HARDWARE SETUP 4. SYSTEM SECURITY
2. COMMUNICATIONS 5. COPY PROFILE
3. REFLOW SETUP
NUMBER Select an item, Graph or Data
Graph Key
This key displays the graphic screen for editing the heat profile parameters with
the keypad or cursor keys. After editing the heat profile parameters, pressing the
GRAPH
key saves the new parameters to the heat profile noted on the display.
Pressing the
GRAPH
key while in the setup, counter, or heating rate menus returns
the Control to the graphic display mode.
NOTE: The vertical broken lines and curve
captions are shown only to identify the four
profile states.
Graph Curve
An approximate analog representation of the
profile. The Cool time axis is foreshortened for
convenient viewing.
Pre-
40°C
Heat Rise Reflow Cool
1
150 --- 350 180 Celsius
01.0 1.0 03.0 --- Seconds
Preheat
You can use
Preheat
to activate flux for removing solder oxides between solder plated parts. You can
also use
Preheat
to reduce warping on large thermodes by decreasing the temperature difference
between
Preheat
and
Reflow
periods.
The temperature for this state is displayed as 150
q
C (note the Celsius units at the right hand side of the
screen) and 01.0 seconds.
Preheat
can be set from 0 to 99.9 seconds. When it is set to 00.0, the
Preheat
state is omitted from the heat profile.
Rise
You use
Rise
to reduce the thermode warping caused by rapidly heating from the
Preheat
setting to the
Reflow
setting.
Rise
is shown as being set for 1.0 seconds. It can be set from 0 to 9.9 seconds. When it is
set to 0.0, the
Rise
state is omitted. The rise time you select will not necessarily be implemented,
depending on the lower temperature limit that you select (see Lower Temperature Limit in the Reflow
Setup section later in this chapter).
For example, if you select a rise time of 2 seconds, a reflow temperature of 350
q
C, and a lower
temperature limit of 340
q
C, a rise time of 1.7 seconds instead of 2 seconds will be reported on the data
screen if the reflow temperature reaches 340
q
C in 1.7 seconds.