< Dual-In-Line Package Intelligent Power Module >
Series Application note
Publication Date: September 2016
28
2.4.3 Soldering Conditions
The recommended soldering condition is mentioned as below.
(Note: The reflow soldering cannot be recommended for DIPIPM.)
(1) Flow (wave) Soldering
DIPIPM is tested on the condition described in Table 2-4-3 about the soldering thermostability, so the
recommended conditions for flow (wave) soldering are soldering temperature is up to 265°C and the
immersion time is within 11s.
The actual condition might need some adjustment based on its flow condition of solder, the speed of the
conveyer, the land pattern and the through hole shape on the PCB, etc. It is necessary to confirm whether it is
appropriate or not for your real PCB finally..
Table 2-4-3 Reliability test specification
Item
Condition
Soldering thermostability
260±5°C, 10±1s
(2) Hand soldering
Since the temperature impressed upon the DIPIPM may changes based on the soldering iron types
(wattages, shape of soldering tip, etc.) and the land pattern on PCB, the unambiguous hand soldering
condition cannot be decided.
As a general requirement of the temperature profile for hand soldering, the temperature of the root of the
DIPIPM terminal should be kept less than 150°C for considering glass transition temperature (Tg) of the
package molding resin and the thermal withstand capability of internal chips. Therefore, it is necessary to
check the DIPIPM terminal root temperature, solderability and so on in your real PCB, when configure the
soldering temperature profile. (It is recommended to set the soldering time as short as possible.)