<Dual-In-Line Package Intelligent Power Module>
1200V Mini DIPIPM with BSD Series APPLICATION NOTE
Publication Date: September 2015
26
0
50
100
150
200
0
5
10
15
Heating time (s)
T
emp
. of
ter
m
in
al
r
oot (
°C
)
(2) Hand soldering
Since the temperature impressed upon the DIPIPM may changes based on the soldering iron types
(wattages, shape of soldering tip, etc.) and the land pattern on PCB, the unambiguous hand soldering
condition cannot be decided.
As a general requirement of the temperature profile for hand soldering, the temperature of the root of the
DIPIPM terminal should be kept under 150°C for considering glass transition temperature (Tg) of the
package molding resin and the thermal withstand capability of internal chips. Therefore, it is necessary to
check the DIPIPM terminal root temperature, solderability and so on in your real PCB, when configure the
soldering temperature profile. (It is recommended to set the soldering time as short as possible.)
For reference, the evaluation example of hand soldering with 50W soldering iron is described as below.
[Evaluation method]
a. Sample: PSSxxS72FT
b. Evaluation procedure
- Put the soldering tip of 50W iron (temperature set to 400°C) on the terminal within 1mm from the toe.
(The lowest heat capacity terminal (=control terminal) is selected.)
- Measure the temperature rise of the terminal root part by the thermocouple installed on the terminal root.
Fig.2-4-3 Heating and measuring point Fig.2-4-4 Temperature alteration of the terminal root (Example)
[Note]
For soldering iron, it is recommended to select one for semiconductor soldering (12~24V low voltage type,
and the earthed iron tip) and with temperature adjustment function.
Thermocouple
DIPIPM
Soldering iron
1mm
