<Dual-In-Line Package Intelligent Power Module>
1200V Mini DIPIPM with BSD Series APPLICATION NOTE
Publication Date: September 2015
17
2.64
2.51
2.76
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
100
110
120
130
VO
T
o
ut
p
ut
(
V
)
_
LVIC temperature (°C)
Typ.
Max.
Min.
Output
range
without
5k
Ω
pull
down
resistor
(Output
might
be
saturated
under
this
level.)
Output
range
with
5k
Ω
pull
down
resistor
(Output
might
be
saturated
under
this
level.)
Fig.2-2-12 V
OT
output vs. LVIC temperature
(3) Usage of V
OT
function
As mentioned above, the heat of power chips transfers to LVIC through the heat sink and package, so the
relationship between LVIC temperature: Tic(=V
OT
output), case temperature: Tc(under the chip defined on
datasheet), and junction temperature: Tj depends on the system cooling condition, heat sink, control strategy,
etc. For example of PSSxxS72FT, their relationship example in the case of using the heat sink (Table 2-2-7) is
described in Fig.2-2-13. This relationship may be different due to the cooling conditions. So when setting the
threshold temperature for protection, it is necessary to get the relationship between them on your real system.
And when setting threshold temperature Tic, it is important to consider the protection temperature keeps
Tj
150°C.
