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Laurell Technologies
Operations Manual WS-650 Lite Series
Revision Date: 7/26/2011
All information contained in this manual is the property of Laurell Technologies Corporation® and is NOT to be edited, reproduced or
distributed without express written permission from a corporate officer.
65
SECTION 4 - MAINTENANCE
Generally there is very little maintenance required with our processors. Normal
maintenance on the WS-400 Series spin processor is the cleaning the process bowl. It
is recommended to clean the process bowl when processing is completed at the end of
the day. Daily cleanup is a good practice and it prevents the excessive buildup of
material over time. An appropriate solvent or cleaner should be used (wear all required
personal protective equipment). It is recommended to leave the N
2
or
CDA supply on
so that the seal purge is constantly present and to leave the lid in the up position to
allow drying of residual moisture. Any questions regarding the maintenance of your
spin processor can be addressed at
Care should be taken not to flood the process chamber during cleaning.
If unit is equipped with a vacuum chuck,
it is important not to allow chemicals or
chemical cleaners to enter the vacuum path.
NEVER flood or spray solvent such as acetone or any other type of cleaner
directly onto the keypad surface.
Doing so may cause keypad failure
.
Always wet a wipe or cloth with the solvent and gently wipe the keypad
surface.
NOTE!
The vacuum path is not designed for any pressure
. Air pressure or any liquid
forced or drawn into the vacuum chuck will very likely damage the vacuum
sensor, seals, motor and electronics. This type of damage is not covered by our
warranty
CLEANING
- Clean, rinse, then dry your spin processor after each use, taking
care to prevent any chemicals from entering the vacuum path. A good practice is
to cover the chuck during bowl cleaning. This can be done with a wafer with
vacuum turned on or use a cover such as Petri dish.
ALSO DO NOT FLOOD