Laurell Technologies
Operations Manual WS-650-Lite Series
Revision Date: 7/26/2011
All information contained in this manual is the property of Laurell Technologies Corporation® and is NOT to be edited, reproduced or
distributed without express written permission from a corporate officer.
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5. Move from step-to-step by using the “FWD” or “REV” key.
6. To change valve condition highlight the valve field, press the F1 key and edit the
submenu using the “Tab” keys and the
(UP) or
(DOWN) arrow keys. Exit the
submenu by pressing the F2 key. Valve configuration is done at the factory at
time of order.
7. To change sensor action highlight the sensor field, press the F1 key and edit the
submenu using the “Tab” keys and the.
(UP) or
(DOWN) arrow keys. . Exit the
submenu by pressing the F2 key. Sensor configuration is done at the factory at
time of order.
8. When finished press the “Run Mode” key.
Example of an etch program.
This is for example only; the user must find the best
parameters for their process.
PROGRAMMING EXAMPLE
Program: Etch_1
Valve
Identification
A BHF
E
B DI
F
C N2
G
D H
DOME
Step Time
99 59.9
Speed
0-6,000
Valves
X=ON
Accel
Comment
Min
Sec
1
5 300
A B C D E F G H
300
This step is to get the chuck
rotating at step 2 spin speed.
2
30 300
A
X
B C D E F G H
X
300
Spin speed same as step 1.
Dispense BHF enough time
to etch substrate. #1
Dispense pressure 10psi.
Dome N2 on, 20psi. #8
3
30 300
A
B
X
C D E F G H
X
300
Purge BHF line. #2
Rinse wafer.
Dome N2 on. #8
4
1
00 3000
A
B
C
X
D E F G H
X
5000
Blow out BHF line. #3
Blow / spin dry wafer.
N2 dome on #8
5
1 2 3 4 5 6 7
8
3.6 - RUNNING THE 650 CONTROLLER
1. Select the program to be run using the “Select Process” key. Press the “Run
Mode” key. The program name will appear on the Title line
