digital audio
modular
processing system
C8000
4/8/16 channels DSP with SDI & system-bus I/O
C8492(B)
page
3/30
Video Latency
Input to Output
120 … 200pixel, depends on video standard
Audio Latency
(SDI)
Input to Output
Embedder and de-embedder combined
HD, 3G < 0.6ms
SD typ. 1.5ms (< 2ms)
Power Supply
5Vdc (4.75 … 5.25V), max. 1.200mA
Dimension
3RU, 4HP, 160mm depth (DIN41612 backplane connector)
Environmental
Operating temperature 0 … 40ºC,
Non-operating -20 … 70ºC,
Humidity < 90%, non-condensing
General Features
•
Power fail relay bypass (may be activated via GUI)
•
Lip-Sync compensation for processed and non-processed audio
signals
•
Dedicated routing for non-processed channels, all channels
can be routed to/from the device or looped through
•
Test pattern generator
•
Master-sync capable
Location of switches:
INIT
1: BUS-EN
2: H-CAN
3:
4: ID+16
5: MASTER
6:
SW1
ADDRESS
