Reference Thermal Solution
Intel
®
E7230 Chipset Memory Controller Hub (MCH)
Thermal/Mechanical Design Guide
23
6.4
Board-Level Components Keepout Dimensions
The location of hole patterns and keepout zones for the reference thermal solution are shown in
Figure 6-3
and
Figure 6-4
.
Figure 6-2. Plastic Wave Soldering Heatsink Volumetric Envelope for the Chipset MCH
TN
B
Motherboard
Heatsink Base
Die
FCBGA + Solder
Balls
Heatsink Fin
Heatsink Fin
Ramp
Retainer
TIM
26.79 mm
48.0 mm
60.6 mm
47.0 mm
135
O
Max 2.2 mm
Component
Height
No
component
this Area
Содержание Intel E7230 MCH
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Страница 12: ...Packaging Technology 12 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...
Страница 14: ...Thermal Specifications 14 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...
Страница 16: ...Thermal Simulation 16 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...
Страница 20: ...Thermal Metrology 20 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...
