Reference Thermal Solution
22
Intel
®
E7230 Chipset Memory Controller Hub (MCH)
Thermal/Mechanical Design Guide
Note:
Heatsink test result is based on End Of Line TIM performance, for worst case Heatsink
performance with End of Life TIM, add +1.0C/W offset to Psi_ca.
6.3
Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width, and depth constraints typically placed on the Intel
®
E7230 chipset
MCH thermal solution are shown in
Figure 6-2
.
When using heatsinks that extend beyond the chipset MCH reference heatsink envelope shown in
Figure 6-2
, any motherboard components placed between the heatsink and motherboard cannot
exceed 2.19 mm (0.09 in.) in height.
Figure 6-1.
Plastic Wave Soldering Heatsink Measured Thermal Performance
versus Approach Velocity
Содержание Intel E7230 MCH
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Страница 12: ...Packaging Technology 12 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...
Страница 14: ...Thermal Specifications 14 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...
Страница 16: ...Thermal Simulation 16 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...
Страница 20: ...Thermal Metrology 20 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...
