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Thermal Simulation

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Intel

®

E7230 Chipset Memory Controller Hub (MCH)

Thermal/Mechanical Design Guide

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Содержание Intel E7230 MCH

Страница 1: ...Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide July 2005 Document Number 308335 001...

Страница 2: ...out notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsib...

Страница 3: ...dology 17 5 2 Power Simulation Software 19 6 Reference Thermal Solution 21 6 1 Operating Environment 21 6 2 Heatsink Performance 21 6 3 Mechanical Design Envelope 22 6 4 Board Level Components Keepout...

Страница 4: ...ent Keepout 24 6 4 Retention Mechanism Component Keepout Zones 25 6 5 Plastic Wave Soldering Heatsink Assembly 26 6 6 Plastic Wave Soldering Heatsink Extrusion Profile 27 B 1 Plastic Wave Soldering He...

Страница 5: ...Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide 5 Revision History Revision Number Description Revision Date 001 Initial Release June 2005...

Страница 6: ...6 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...

Страница 7: ...rent system cooling characteristics is through careful chassis design and placement of fans vents and ducts When additional cooling is required component thermal solutions may be implemented in conjun...

Страница 8: ...geometric center of the top of the package die or IHS TDP Thermal design power Thermal solutions should be designed to dissipate this target power level TDP is not the maximum power that the chipset c...

Страница 9: ...ure 2 2 and Figure 2 3 For information on the Intel 6700PXH 64 bit PCI Hub package refer to the Intel 6700PXH 64 bit PCI Hub 6702PXH 64 bit PCI Hub PXH PXH V Thermal Mechanical Design Guidelines For i...

Страница 10: ...3 Seating Plane 1 92 0 078 mm See note 1 Decoup Cap 0 7 mm Max 2 355 0 082 mm 0 84 0 05 mm 0 20 See note 4 Notes 1 Primary datum C and seating plan are defined by the spherical crowns of the solder ba...

Страница 11: ...e mechanical load limits must not be exceeded during heatsink installation mechanical stress testing standard shipping conditions and or any other use condition Notes 1 The heatsink attach solutions m...

Страница 12: ...Packaging Technology 12 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...

Страница 13: ...et MCH FC BGA packages have poor heat transfer capability into the board and have minimal thermal capability without a thermal solution Intel recommends that system designers plan for a heatsink when...

Страница 14: ...Thermal Specifications 14 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...

Страница 15: ...s guides to aid system designers in simulating analyzing and optimizing their thermal solutions in an integrated system level environment The models are for use with the commercially available Computa...

Страница 16: ...Thermal Simulation 16 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...

Страница 17: ...rmal contact between the thermocouple junction and the surface of the package heat loss by radiation and or convection conduction through thermocouple leads and or contact between the thermocouple cem...

Страница 18: ...mended m etrology Setup the system in the desired configuration Tdie Specification No Yes Heatsink Required Select Heatsink End Start Run the Power program and m onitor the device die tem perature At...

Страница 19: ...al solution under worst case realistic application conditions Intel is developing a software utility that operates the chipset at near worst case thermal power dissipation The power simulation softwar...

Страница 20: ...Thermal Metrology 20 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...

Страница 21: ...H7 refer to thermal specification in the Intel I O Controller Hub 7 ICH7 Thermal Design Guidelines 6 1 Operating Environment The reference thermal solution was designed assuming a maximum local ambien...

Страница 22: ...nique mechanical volume and height restrictions or implementation requirements the height width and depth constraints typically placed on the Intel E7230 chipset MCH thermal solution are shown in Figu...

Страница 23: ...e patterns and keepout zones for the reference thermal solution are shown in Figure 6 3 and Figure 6 4 Figure 6 2 Plastic Wave Soldering Heatsink Volumetric Envelope for the Chipset MCH TN B Motherboa...

Страница 24: ...h each end hooked through an anchor soldered to the board Figure 6 5 shows the reference thermal solution assembly and associated components Full mechanical drawings of the thermal solution assembly a...

Страница 25: ...Orientation Since this solution is based on a unidirectional heatsink mean airflow direction must be aligned with the direction of the heatsink fins Figure 6 4 Retention Mechanism Component Keepout Zo...

Страница 26: ...ween the die and heatsink The reference thermal solution uses Chomerics T 710 0 127 mm 0 005 in thick 15 mm x 15 mm 0 60 in x 0 60 in square Note Unflowed or dry Chomerics T710 has a material thicknes...

Страница 27: ...amp clip and the other is wire clip Each end of the wire clip is attached to the ramp clip which in turn attaches themselves to anchors to fasten the overall heatsink assembly to the motherboard See A...

Страница 28: ...the end user environment the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume Some general recommendations are sho...

Страница 29: ...om tw Harry Lin CCI ACK USA 714 739 5797 hlinack aol com Undirectional Pin Fin Heatsink 42 30 x 42 30 x 29 0 mm C92139 001 CCI Monica Chih Taiwan 866 2 29952666 x131 monica_chih ccic com tw Harry Lin...

Страница 30: ...liers Contact the supplier directly to verify time of component availability Solder Down Anchor C85376 001 Wieson Rick Lin Deputy Manager Project Sales Department Add 7F No 276 Section 1 Tatung Road H...

Страница 31: ...stic Wave Soldering Heatsink Assembly Drawing Figure B 1 Plastic Wave Soldering Heatsink Drawing 1 of 2 Figure B 2 Plastic Wave Soldering Heatsink Drawing 2 of 2 Figure B 3 Plastic Wave Soldering Heat...

Страница 32: ...Mechanical Drawings 32 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide Figure B 1 Plastic Wave Soldering Heatsink Assembly Drawing...

Страница 33: ...Mechanical Drawings Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide 33 Figure B 2 Plastic Wave Soldering Heatsink Drawing 1 of 2...

Страница 34: ...Mechanical Drawings 34 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide Figure B 3 Plastic Wave Soldering Heatsink Drawing 2 of 2...

Страница 35: ...Mechanical Drawings Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide 35 Figure B 4 Plastic Wave Soldering Heatsink Ramp Clip Drawing 1 of 2...

Страница 36: ...Mechanical Drawings 36 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide Figure B 5 Plastic Wave Soldering Heatsink Ramp Clip Drawing 2 of 2...

Страница 37: ...Mechanical Drawings Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide 37 Figure B 6 Plastic Wave Soldering Heatsink Wire Clip Drawing...

Страница 38: ...Mechanical Drawings 38 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide Figure B 7 Plastic Wave Soldering Heatsink Solder down Anchor Drawing...

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