Packaging Technology
10
Intel
®
E7230 Chipset Memory Controller Hub (MCH)
Thermal/Mechanical Design Guide
NOTES:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.
Figure 2-2. MCH Package Dimensions (Side View)
Figure 2-3. MCH Package Dimensions (Bottom View)
0.20
–C–
Die
Substrate
0.435 ± 0.025 mm
See note 3
Seating Plane
1.92 ± 0.078 mm
See note 1.
Decoup
Cap
0.7 mm Max
2.355 ± 0.082 mm
0.84 ± 0.05 mm
0.20 See note 4.
Notes:
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)
2. All dimensions and tolerances conform to ANSI Y14.5M-1994
3. BGA has a pre-SMT height of 0.5 mm and post-SMT height of 0.41-0.46 mm
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave
(bowl shaped) orientation after reflow
Содержание Intel E7230 MCH
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