Intel Intel E7230 MCH, Термомеханическое конструкторское руководство

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Introduction
8 Intel
®
E7230 Chipset Memory Controller Hub (MCH)
Thermal/Mechanical Design Guide
bus. It contains two PCI bus interfaces that can be independently
configured to operate in PCI (33 or 66 MHz) or PCI-X* mode 1 (66, 100
or 133 MHz), for either 32- or 64-bit PCI devices.
PXH-V Intel
®
6702PXH 64-bit PCI Hub. The chipset component that performs
PCI bridging functions between the PCI Express interface and the PCI
Bus. It contains one PCI bus interface that can be configured to operate
in PCI (33 or 66 MHz) or PCI-X mode 1 (66, 100 or 133 MHz).
T
case_max
Maximum die or IHS temperature allowed. This temperature is
measured at the geometric center of the top of the package die or IHS.
T
case_min
Minimum die or IHS temperature allowed. This temperature is measured
at the geometric center of the top of the package die or IHS.
TDP Thermal design power. Thermal solutions should be designed to
dissipate this target power level. TDP is not the maximum power that the
chipset can dissipate.
1.2 Reference Documents
The reader of this specification should also be familiar with material and concepts presented in the
following documents:
§
Document Title Document Number / Location
Intel
®
I/O Controller Hub 7 (ICH7) Thermal Design Guidelines
Intel
®
I/O Controller Hub 7 (ICH7) Datasheet
Intel
®
E7320 Chipset Memory Controller Hub(MCH) Datasheet
Intel
®
Pentium
®
D Processor 840, 830 and 820 Datasheet
Intel
®
Pentium
®
D Processor and Intel
®
Pentium
®
Processor Extreme
Edition 840 Thermal and Mechanical Design Guidelines
Intel
®
Pentium
®
Processor Extreme Edition and Intel
®
Pentium
®
D
Processor Specification Update
BGA/OLGA Assembly Development Guide Contact your Intel Field Sales
Representative
Various system thermal design suggestions http://www.formfactors.org